Organic synthesis, pharmaceutical intermediates. The chemical copper plating additive, used in combination with potassium ferrocyanide, can effectively control the copper deposition rate and avoid the formation of cuprous oxide. This product is an analytical reagent for the determination of ferrous, silver, cadmium and molybdenum as an indicator of oxidation and reduction.
Product Name
2,2'-Bipyridine
Multiple Names
2,2'-Bipyridine;
2,2'-Dipyridine;
2,2'-Dipyridyl;
2,2'-Bipyridyl;
2,2-Dipyridyl
CAS No. 366-18-7
EC No. 206-674-4
MF No. C10H8N2
MW No. 156.1839
Assay Item | Standard |
Form | Crystalline Powder |
Color | White to almost white |
Acidity Coefficient (pKa) | pK1:-0.52(+2);pK2:4.352(+1) (20°C） |
Melting Point | 70-73 °C(lit.） |
Refractive Index | 1.4820 (estimate) |
PH | 7.5 (5g/l, H2O, 25℃) |
Easily soluble in ethanol, ether, benzene, chloroform and petroleum ether
Effectively control copper deposition rate
Stable, Incompatible with strong oxidizing agents, most common metals
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